BibTeX record conf/ispd/ZhuCPSYL20

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@inproceedings{DBLP:conf/ispd/ZhuCPSYL20,
  author       = {Lingjun Zhu and
                  Kyungwook Chang and
                  Dusan Petranovic and
                  Saurabh Sinha and
                  Yun Seop Yu and
                  Sung Kyu Lim},
  editor       = {William Swartz and
                  Jens Lienig},
  title        = {Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face
                  Bonded 3D ICs},
  booktitle    = {{ISPD} 2020: International Symposium on Physical Design, Taipei, Taiwan,
                  March 29 - April 1, 2020, delayed to September 20-23, 2020},
  pages        = {39--46},
  publisher    = {{ACM}},
  year         = {2020},
  url          = {https://doi.org/10.1145/3372780.3378169},
  doi          = {10.1145/3372780.3378169},
  timestamp    = {Sun, 02 Oct 2022 16:10:03 +0200},
  biburl       = {https://dblp.org/rec/conf/ispd/ZhuCPSYL20.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}