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BibTeX record conf/dac/DevWR13
@inproceedings{DBLP:conf/dac/DevWR13, author = {Kapil Dev and Gary L. Woods and Sherief Reda}, title = {High-throughput {TSV} testing and characterization for 3D integration using thermal mapping}, booktitle = {The 50th Annual Design Automation Conference 2013, {DAC} '13, Austin, TX, USA, May 29 - June 07, 2013}, pages = {73:1--73:6}, publisher = {{ACM}}, year = {2013}, url = {https://doi.org/10.1145/2463209.2488823}, doi = {10.1145/2463209.2488823}, timestamp = {Tue, 07 Sep 2021 19:59:27 +0200}, biburl = {https://dblp.org/rec/conf/dac/DevWR13.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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