BibTeX record conf/3dic/XuBRZL09

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@inproceedings{DBLP:conf/3dic/XuBRZL09,
  author       = {Zheng Xu and
                  Adam Beece and
                  Kenneth Rose and
                  Tong Zhang and
                  Jian{-}Qiang Lu},
  title        = {Modeling and evaluation for electrical characteristics of through-strata-vias
                  {(TSVS)} in three-dimensional integration},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--9},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306543},
  doi          = {10.1109/3DIC.2009.5306543},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/XuBRZL09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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