BibTeX record conf/3dic/LeducACZSRRVBBCFS09

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@inproceedings{DBLP:conf/3dic/LeducACZSRRVBBCFS09,
  author       = {Patrick Leduc and
                  Myriam Assous and
                  L{\'{e}}a Di Cioccio and
                  Marc Zussy and
                  Thomas Signamarcheix and
                  Antonio Roman and
                  Maxime Rousseau and
                  Sophie Verrun and
                  Laurent Bally and
                  David Bouchu and
                  Lionel Cadix and
                  Alexis Farcy and
                  Nicolas Sillon},
  title        = {First integration of Cu {TSV} using die-to-wafer direct bonding and
                  planarization},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306602},
  doi          = {10.1109/3DIC.2009.5306602},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LeducACZSRRVBBCFS09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}