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S. Miedl

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2005
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U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee:
AVD^® technology for deposition of next generation devices. Microelectron. Reliab. 45(5-6): 945-948 (2005)

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