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Jianxin Wang 0005

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

ORCID
- 0000-0002-4166-8520
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affiliation: Osaka University, Joining and Welding Research Institute, Japan

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Jianxin Wang (aka: JianXin Wang, Jian-Xin Wang, Jian-xin Wang) — disambiguation page
Jianxin Wang 0001 (aka: Jian-Xin Wang 0001, Jian-xin Wang 0001) — Central South University, School of Computer Science and Engineering, Changsha, China
Jianxin Wang 0002 — Nanjing University of Science and Technology, School of Electronic and Optical Engineering, Nanjing, China
Jianxin Wang 0003 — Nanjing University of Aeronautics and Astronautics, College of Economics and Management, Nanjing, China
Jianxin Wang 0004 — Beijing Forestry University, School of Information Science and Technology, China
Jianxin Wang 0006 — University of Science and Technology of China, School of Computer Science and Technology, Hefei, Anhui, China

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2010 – 2019

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2014
[j1]
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Jianxin Wang, Hiroshi Nishikawa:
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging. Microelectron. Reliab. 54(8): 1583-1591 (2014)

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Hiroshi Nishikawa

[j1]

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last updated on 2024-11-06 21:33 CET by the dblp team

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