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Yabin Zhang 0003

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affiliation: Xihua University, School of Electrical Engineering and Electronic Information, Sichuan, China
affiliation (PhD 2013): University of Pisa, Department of Information Engineering, Italy

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2020 – today

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2021
[j3]
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Yabin Zhang:
Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components' Temperature. IEEE Access 9: 92925-92940 (2021)

2010 – 2019

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2014
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Yabin Zhang, Paolo Emilio Bagnoli:
A modeling methodology for thermal analysis of the PCB structure. Microelectron. J. 45(8): 1033-1052 (2014)
2013
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Yabin Zhang:
Modeling Methodology for Reliability-Concerned Current Density Analysis of PCB Tracks and Thermal Analysis of PCB Structure. University of Pisa, Italy, 2013
2010
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Paolo Emilio Bagnoli, Yabin Zhang:
Electro-thermal simulation of metal interconnections under high current flow. Microelectron. Reliab. 50(9-11): 1672-1677 (2010)

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