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R. K. Shiue

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Journal Articles

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2003
[j2]
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R. K. Shiue, L. W. Tsay, C. L. Lin, J. L. Ou:
The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate. Microelectron. Reliab. 43(3): 453-463 (2003)
2001
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W. D. Zhuang, P. C. Chang, F. Y. Chou, R. K. Shiue:
Effect of solder creep on the reliability of large area die attachment. Microelectron. Reliab. 41(12): 2011-2021 (2001)

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