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Hamid R. Ghorbani

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2000 – 2009

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2008
[j3]
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Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt:
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints. Microelectron. Reliab. 48(3): 455-470 (2008)
2006
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Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt:
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. Microelectron. Reliab. 46(2-4): 574-588 (2006)
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Hamid R. Ghorbani, Jan K. Spelt:
Interfacial thermal stresses in solder joints of leadless chip resistors. Microelectron. Reliab. 46(5-6): 873-884 (2006)

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