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Yun C. Chung
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2020 – today
- 2022
- [c8]Yun C. Chung:
Ultrahigh-Speed OTDM System for Next-Generation Datacenter Networks. OECC/PSC 2022: 1-2
2010 – 2019
- 2018
- [c7]Byung Gon Kim, Sung Hyun Bae, Yun C. Chung:
MPI Noise Reduction in RoF-Based Mobile Fronthaul Network Using High-Frequency Phase Dither. ECOC 2018: 1-3 - 2017
- [c6]Byung Gon Kim, Sung Hyun Bae, Yun C. Chung:
294-Gb/s CPRI-Equivalent-Rate Radio-over-Fiber Mobile Fronthaul Network Using a 1.55-µm DML and Dispersion-Induced CSO Cancellation. ECOC 2017: 1-3 - [c5]Masatoshi Suzuki, Shota Ishimura, Kazuki Tanaka, Abdelmoula Bekkali, Shinobu Nanba, Kosuke Nishimura, Byung Gon Kim, Hoon Kim, Yun C. Chung:
Optical and wireless integrated technologies for future mobile networks. ICTON 2017: 1-4 - 2016
- [c4]Byung Gon Kim, Sung Hyun Bae, Hoon Kim, Yun C. Chung:
Optical fronthaul technologies for next-generation mobile communications. ICTON 2016: 1-3
2000 – 2009
- 2005
- [j7]Jung W. Park, Yang H. Shin, Yun C. Chung:
Hybrid cutting simulation via discrete vector model. Comput. Aided Des. 37(4): 419-430 (2005) - 2004
- [c3]Hayong Shin, Joon C. Park, Byoung Kyu Choi, Yun C. Chung, Siyoul Rhee:
Efficient Topology Construction from Triangle Soup. GMP 2004: 359-364 - 2003
- [j6]Hayong Shin, Gustav J. Olling, Yun C. Chung, Bo Hyoung Kim, Su K. Cho:
An integrated CAPP/CAM system for stamping die pattern machining. Comput. Aided Des. 35(2): 203-213 (2003) - [j5]Sang C. Park, Yun C. Chung:
Tool-path generation from measured data. Comput. Aided Des. 35(5): 467-475 (2003) - [j4]Sang C. Park, Yun C. Chung:
Mitered offset for profile machining. Comput. Aided Des. 35(5): 501-505 (2003) - [j3]Joon C. Park, Yun C. Chung:
A tolerant approach to reconstruct topology from unorganized trimmed surfaces. Comput. Aided Des. 35(9): 807-812 (2003) - [j2]Sang C. Park, Yun C. Chung, Byoung Kyu Choi:
Contour-parallel offset machining without tool-retractions. Comput. Aided Des. 35(9): 841-849 (2003)
1990 – 1999
- 1998
- [j1]Yun C. Chung, Jung W. Park, Hayong Shin, Byoung Kyu Choi:
Modeling the surface swept by a generalized cutter for NC verification. Comput. Aided Des. 30(8): 587-594 (1998) - [c2]Hayong Shin, Robert M. Trecapelli, Andrew Shudra Jr., Yun C. Chung:
A Generative Approach for Die Pattern Matching. SSM 1998: 24- - [c1]Jung W. Park, Yun C. Chung, Bo Hyoung Kim, Byoung Kyu Choi:
Pencil Curve Tracing via Virtual Digitizing. SSM 1998: 279-
Coauthor Index
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