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ORCIDKameswar Rao Vaddina
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2020 – today
- 2021
[c17]Kameswar Rao Vaddina, Laurent Lefèvre, Anne-Cécile Orgerie:
Experimental Workflow for Energy and Temperature Profiling on HPC Systems. ISCC 2021: 1-7
2010 – 2019
- 2017
- [c16]Kameswar Rao Vaddina, Florian Brandner, Gérard Memmi, Pierre Jouvelot:
Experimental energy profiling of energy-critical embedded applications. SoftCOM 2017: 1-6 - [c15]Karel De Vogeleer, Kameswar Rao Vaddina, Florian Brandner
, Pierre Jouvelot, Gérard Memmi:
Modeling the energy consumption of programs: Thermal aspects and energy/frequency convexity rule (invited paper). WCSP 2017: 1-10 - 2016
- [c14]Kameswar Rao Vaddina, Juan M. Cebrian, Lasse Natvig:
Transient Temperature Prediction for Aging Thermal Sensors Using Artificial Neural Network. PDP 2016: 51-57 - 2014
- [j5]Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Khalid Latif, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
High-Performance and Fault-Tolerant 3D NoC-Bus Hybrid Architecture Using ARB-NET-Based Adaptive Monitoring Platform. IEEE Trans. Computers 63(3): 734-747 (2014) - 2013
- [j4]Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila:
Exploration of Temperature-Aware Placement Approaches in 2D and 3D Stacked Systems. Int. J. Adapt. Resilient Auton. Syst. 4(3): 61-81 (2013) - [j3]Kameswar Rao Vaddina, Amir-Mohammad Rahmani, Mohammad Fattah, Pasi Liljeberg, Juha Plosila:
Design space exploration of thermal-aware many-core systems. J. Syst. Archit. 59(10-D): 1197-1213 (2013) - [j2]Pekka Nikander, Kameswar Rao Vaddina, Petri Liuha, Hannu Tenhunen:
ELL-i: An inexpensive platform for fixed things. Scalable Comput. Pract. Exp. 14(3) (2013) - 2012
- [j1]Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Khalid Latif, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
Design and management of high-performance, reliable and thermal-aware 3D networks-on-chip. IET Circuits Devices Syst. 6(5): 308-321 (2012) - [c13]Amir-Mohammad Rahmani, Khalid Latif, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
ARB-NET: A novel adaptive monitoring platform for stacked mesh 3D NoC architectures. ASP-DAC 2012: 413-418 - [c12]Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
Power and Thermal Analysis of Stacked Mesh 3D NoC Using AdaptiveXYZ Routing Algorithm. DSD 2012: 208-215 - [c11]Robert Eksten, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila:
Analysis of Power Management Strategies for a Single-Chip Cloud Computer. MARC@RWTH 2012: 32-37 - [c10]Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Khalid Latif, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
Generic Monitoring and Management Infrastructure for 3D NoC-Bus Hybrid Architectures. NOCS 2012: 177-184 - 2011
- [c9]Khalid Latif, Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Tiberiu Seceleanu, Pasi Liljeberg, Hannu Tenhunen:
Enhancing Performance of NoC-Based Architectures Using Heuristic Virtual-Channel Sharing Approach. COMPSAC 2011: 442-447 - [c8]Khalid Latif, Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Tiberiu Seceleanu, Pasi Liljeberg, Hannu Tenhunen:
Enhancing Performance Sustainability of Fault Tolerant Routing Algorithms in NoC-Based Architectures. DSD 2011: 626-633 - [c7]Kameswar Rao Vaddina, Amir-Mohammad Rahmani, Khalid Latif, Pasi Liljeberg, Juha Plosila:
Thermal Analysis of Job Allocation and Scheduling Schemes for 3D Stacked NoC's. DSD 2011: 643-648 - [c6]Amir-Mohammad Rahmani, Khalid Latif, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
Power-Efficient Inter-Layer Communication Architectures for 3D NoC. ISVLSI 2011: 355-356 - [c5]Kameswar Rao Vaddina, Amir-Mohammad Rahmani, Khalid Latif, Pasi Liljeberg, Juha Plosila:
Thermal Analysis of Advanced 3D Stacked Systems. ISVLSI 2011: 371-372 - [c4]Amir-Mohammad Rahmani, Pasi Liljeberg, Khalid Latif, Juha Plosila, Kameswar Rao Vaddina, Hannu Tenhunen:
Congestion aware, fault tolerant, and thermally efficient inter-layer communication scheme for hybrid NoC-bus 3D architectures. NOCS 2011: 65-72 - [c3]Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
Power and Area Optimization of 3D Networks-on-Chip Using Smart and Efficient Vertical Channels. PATMOS 2011: 278-287 - 2010
- [c2]Kameswar Rao Vaddina, Tamoghna Mitra, Pasi Liljeberg, Juha Plosila:
Thermal modelling of 3D multicore systems in a flip-chip package. SoCC 2010: 379-383
2000 – 2009
- 2009
- [c1]Kameswar Rao Vaddina, Ethiopia Nigussie, Pasi Liljeberg, Juha Plosila:
Self-timed thermal sensing and monitoring of multicore systems. DDECS 2009: 246-251
Coauthor Index
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