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ORCIDBo Li 0051
李博
Person information
- unicode name: 李博
- affiliation: Chinese Academy of Sciences, Institute of Microelectronics, Beijing, China
- affiliation (PhD 2012): INSA Lyon, Ampere Lab, Villeurbanne, France
Other persons with the same name
- Bo Li — disambiguation page
- Bo Li 0001
![[0000-0003-2083-9105]](https://dblp.uni-trier.de/img/orcid-mark.12x12.png "0000-0003-2083-9105")
— Hong Kong University of Science and Technology, Department of Computer Science and Engineering, Hong Kong (and 4 more) - Bo Li 0002 — Wuhan University of Science and Technology, School of Computer Science and Technology, Wuhan, China (and 5 more)
- Bo Li 0003 — Northeastern University, School of Information Science and Engineering, Shenyang, China
- Bo Li 0004 — Northwestern Polytechnical University, School of Electronics and Information, Xi'an, China (and 2 more)
- Bo Li 0005 — Beihang University, Beijing Advanced Innovation Center for Big Data and Brain Computing and State Key Laboratory of Software Development Environment, Beijing, China (and 1 more)
- Bo Li 0006 — Beihang University, School of Computer Science and Engineering, Beijing Key Laboratory of Digital Media and State Key Laboratory of Virtual Reality Technology and Systems, Beijing, China (and 1 more)
- Bo Li 0007 — University of California San Diego, Department of Mathematics and Center for Theoretical Biological Physics, San Diego, CA, USA (and 1 more)
- Bo Li 0008 — Qingdao University of Science and Technology
- Bo Li 0009 — Chinese Academy of Sciences, Institute of Computing Technology, National Research Center for Intelligent Computing Systems, Beijing, China
- Bo Li 0010 — University of Essex
- Bo Li 0011 — University of Florida, Computer and Information Science and Engineering Department, Gainesville, FL, USA
- Bo Li 0012 — Université Joseph Fourier, Grenoble
- Bo Li 0013 — University of Southern Mississippi, School of Computing, Long Beach, USA (and 2 more)
- Bo Li 0014 — Samsung R&D, Mountain View, CA, USA (and 1 more)
- Bo Li 0015 — Harvard Medical School, Boston, MA, USA (and 2 more)
- Bo Li 0016 — Beijing Normal University, Faculty of Geographical Science, College of Resources Science and Technology, State Key Laboratory of Earth Surface Processes and Resource Ecology, Beijing, China
- Bo Li 0017 — Beijing Jiao Tong University, State Key Lab. of Rail Traffic Control & Safety, Beijing, China
- Bo Li 0018 — Baidu Inc., Institute of Deep Learning, Beijing, China (and 1 more)
- Bo Li 0019 — Purdue University, Department of Statistics, West Lafayette, IN, USA
- Bo Li 0020 — Washington University, St. Louis, MO, USA
- Bo Li 0021 — Auburn University
- Bo Li 0022 — Sun Yet-Sen University, Zhongshan School of Medicine, China (and 1 more)
- Bo Li 0023 — Central China Normal University, School of Educational Information Technology, Wuhan, China (and 2 more)
- Bo Li 0024 — Ningbo Supply Chain Innovation Institute China, China
- Bo Li 0025 — Yunnan University, School of Information Science and Engineering, Kunming, China
- Bo Li 0026 — University of Chicago, Department of Computer Science, IL, USA (and 4 more)
- Bo Li 0027 — Qualcomm, San Diego, CA, USA (and 1 more)
- Bo Li 0028 — Google Inc., USA (and 1 more)
- Bo Li 0029 — CAS, Institute of Automation, State Key Laboratory of Management and Control for Complex Systems, Beijing, China
- Bo Li 0030 — Xi'an Hi-Tech Research Institute, Xi'an, China (and 1 more)
- Bo Li 0031 — Beijing Institute of Technology, Beijing Lab of Intelligent Information Technology, Beijing, China
- Bo Li 0032 — Virginia Tech, Blacksburg, VA, USA
- Bo Li 0033 — University of Maryland, Electrical and Computer Engineering Department, College Park, MD, USA
- Bo Li 0034 — Harbin Institute of Technology, School of Information and Electrical Engineering, Weihai, China
- Bo Li 0036 — Clemson University, SC, USA
- Bo Li 0037 — Hong Kong Polytechnic University, Department of Computing, Hong Kong (and 4 more)
- Bo Li 0038 — Nanjing University, School of Electronic Science and Engineering, China
- Bo Li 0039 — Chinese Academy of Sciences, Key Laboratory of Mathematics Mechanization, Beijing, China (and 1 more)
- Bo Li 0040 — Lanzhou Jiaotong University, School of Automation & Electrical Engineering, China
- Bo Li 0041 — Northeastern University, Shenyang, China
- Bo Li 0042 — China University of Petroleum, Department of Software Engineering, Qingdao, China
- Bo Li 0043 — Peking University, School of Software and Microelectronics, Beijing, China
- Bo Li 0045 — Chongqing University, School of Electrical Engineering, State Key Laboratory of Power Transmission Equipment & System Security and New Technology, China
- Bo Li 0046 — Shanghai Jiao Tong University, School of Medicine, Shanghai Ninth People's Hospital, China
- Bo Li 0047 — Loughborough University, UK
- Bo Li 0048 — Florida Atlantic University, Boca Raton, FL, USA
- Bo Li 0050 — Nanjing University of Finance and Economics, School of Applied Mathematics, China (and 1 more)
- Bo Li 0052 — Zhejiang University, College of Information Science and Electronic Engineering, Hangzhou, China
- Bo Li 0053 — Southwest University, College of Electronic and Information Engineering, Chongqing, China (and 1 more)
- Bo Li 0054 — Southwest Jiaotong University, School of Information Science and Technology, Chengdu, China (and 1 more)
- Bo Li 0055 — Chinese Academy of Sciences, Institute of Computer Application, Chengdu, China
- Bo Li 0056 — Shanghai Jiao Tong University, School of Electronic, Information, and Electrical Engineering, Department of Micro/Nano Electronics, China
- Bo Li 0057 — Teesside University, School of Science Engineering and Design, Middlesbrough, UK
- Bo Li 0058 — University of Georgia, Athens, GA, USA
- Bo Li 0059 — Liaoning University of Technology, School of Electronics and Information Engineering, Jinzhou, China (and 1 more)
- Bo Li 0060 — Guangdong University of Technology, School of Automation, Guangzhou, China
- Bo Li 0061 — Nanjing University, State Key Laboratory for Novel Software Technology, Nanjing, China
- Bo Li 0062 — Nankai University, College of Computer and Control Engineering, Tianjin, China
- Bo Li 0063 — Chinese Academy of Sciences, Institute of Information Engineering, Beijing, China (and 1 more)
- Bo Li 0064 — Tsinghua University, School of Economics and Management, Beijing, China
- Bo Li 0065 — Southwest University of Science and Technology, Mianyang, China (and 1 more)
- Bo Li 0066 — Xidian University, School of Mathematics and Statistics, Xian, China
- Bo Li 0067 — Shandong University of Technology, School of Transportation and Vehicle Engineering, Zibo, China
- Bo Li 0068 — Harbin Institute of Technology, Reliability Institute for Electric Apparatus and Electronics, China
- Bo Li 0069 — Shanghai Maritime University, Institute of Logistics Science and Engineering, China
- Bo Li 0070 — Nanjing Agricultural University, College of Engineering, China
- Bo Li 0071 — Zhejiang University, School of Aeronautics and Astronautics, Hangzhou, China
- Bo Li 0072 — University of Electronic Science and Technology of China, School of Astronautics and Aeronautics, Chengdu, China
- Bo Li 0073 — China NARI Group Corporation, State Grid Electronic Power Research Institute, Nanjing, China
- Bo Li 0074 — Sichuan University, College of Electronics and Information Engineering, Chengdu, China
- Bo Li 0075 — Glodon Technology Inc., Xian, China
- Bo Li 0076 — Changchun University of Science and Technology, School of Computer Science and Technology, China
- Bo Li 0077 — Dalian University of Technology, School of Control Science and Engineering, China
- Bo Li 0078 — University of California, San Diego, Department of Mathematics, USA
- Bo Li 0079 — National University of Singapore, Singapore (and 1 more)
- Bo Li 0080 — University of California, Berkeley, CA, USA
- Bo Li 0081 — Xidian University, Xi'an, China
- Bo Li 0082 — Aston University, Birmingham, UK (and 2 more)
- Bo Li 0084 — Sichuan University, Institute for Disaster Management and Reconstruction, Chengdu, China
- Bo Li 0085 — Tianjin University, College of Management and Economics, China
- Bo Li 0086 — Harbin Institute of Technology, School of Computer Science and Technology, Harbin, China
- Bo Li 0087 — Shanghai University of Sport, School of Physical Education and training, Shanghai, China
- Bo Li 0088 — Erasmus MC, Department of Radiology and Nuclear Medicine, Rotterdam, Netherlands (and 1 more)
- Bo Li 0089 — Northwestern Polytechnical University, School of Electronics and Information, Xi'an, China (and 2 more)
- Bo Li 0090 — Northwestern Polytechnical University, School of Electronics and Information, Xi'an, China
- Bo Li 0091 — Northwestern Polytechnical University, School of Mechanical Engineering, Xi'an, China
- Bo Li 0092 — Tianjin University, School of Electrical and Information Engineering, Tianjin, China
- Bo Li 0093 — Chongqing University, School of Pharmaceutical Sciences and Collaborative Innovation Center for Brain Science, Innovative Drug Research and Bioinformatics Group, Chongqing, China
- Bo Li 0094 — Chongqing University, School of Resources and Safety Engineering, State Key Laboratory of Coal Mine Disaster Dynamics and Control, Chongqing, China
- Bo Li 0095 — Tsinghua University, Department of Engineering Mechanics, Institute of Biomechanics and Medical Engineering, Beijing, China
- Bo Li 0096 — Central China Normal University, School of Mathematics and Statistics, Wuhan, China
- Bo Li 0097 — Chongqing Normal University, College of Life Sciences, Chongqing, China
- Bo Li 0098 — Beihang University, Sino-German Joint Software Institute, Beijing, China (and 2 more)
- Bo Li 0099 — Peking University, National Engineering Research Center for Software Engineering, Beijing, China (and 1 more)
- Bo Li 0100 — University of Texas Southwestern Medical Center, Department of Bioinformatics, Dallas, TX, USA
- Bo Li 0102 — Xidian University, School of Telecommunications Engineering, State Key Laboratory of Integrated Services Networks, Xi'an, China
- Bo Li 0103 — Swinburne University of Technology, School of Software and Electrical Engineering, Melbourne, Australia
- Bo Li 0104 — Communication University of China, School of Information and Communication Engineering, Beijing, China
- Bo Li 0105 — Shandong Technology and Business University, School of Computer Science and Technology and School of Statistics, Yantai, China
- Bo Li 0106 — Dalian Polytechnic University, School of Information Science and Engineering, Dalian, China
- Bo Li 0107 — Guizhou University, Key Laboratory of Karst Georesources and Environment, Ministry of Education, Guiyang, China
- Bo Li 0108 — Xi'an Jiaotong University, School of Mechanical Engineering, State Key Laboratory for Mechanical Manufacturing Systems Engineering and Shaanxi Key Lab of Intelligent Robots, Xi'an, China
- Bo Li 0109 — Singapore University of Technology and Design, Department of Engineering Product Development, Singapore
- Bo Li 0110 — Xi'an University of Posts and Telecommunications, School of Communication and Information Engineering, Xi'an, China
- Bo Li 0111 — South China University of Technology, School of Electronic and Information Engineering, Guangzhou, China (and 1 more)
- Bo Li 0112 — Jiangsu University of Technology, School of Electrical and Information Engineering, Changzhou, China
- Bo Li 0113 — Jiangxi University of Science and Technology, Software School, Nanchang, China
- Bo Li 0114 — SenseTime Group Limited, Beijing, China
- Bo Li 0115 — Tencent, Youtu Lab, Shanghai, China
- Bo Li 0116 — Wuhan University of Technology, Institute of Intelligent Manufacturing and Control, Wuhan, China
- Bo Li 0117 — Sun Yat-sen University, Guangdong Key Laboratory of Big Data Analysis and Processing, Guangzhou, China
- Bo Li 0118 — Cerence Inc., Burlington, MA, USA (and 4 more)
- Bo Li 0119 — Technical University of Denmark
- Bo Li 0120 — Guangdong Ocean University, Naval Architecture and Shipping College, Zhanjiang, Guangdong, China (and 1 more)
- Bo Li 0121 — Alibaba Group Inc., Machine Intelligence Technology Lab, Hangzhou, China
- Bo Li 0122 — Nanjing University of Information Science and Technology, School of Computer and Software, China
- Bo Li 0123 — Northwestern Polytechnical University, School of Electronics and Information, Xi'an, China
- Bo Li 0124 — Anhui University of Finance and Economics, School of Finance, Bengbu, China (and 1 more)
- Bo Li 0125 — Nanyang Technological University, S-Lab, Singapore
- Bo Li 0126 — Tongji University, Shanghai, China
- Bo Li 0127 — ShangHai DianJi University, School of Electronic Infomation Engineering, China (and 1 more)
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2020 – today
- 2024
[j20]Yafei Xie, Xiaowu Cai, Yu Lu, Jianying Dang, Longli Pan, Mali Gao, Lei Wang, Bo Li:
An integrated capacitor-less LDO with transient and stability enhancement. IEICE Electron. Express 21: 20240199 (2024)- [j19]Tian Han, Fazhan Zhao, Ximing Fu, Xiaowu Cai, Weiwei Yan, Haitao Zhao, Wenxin Zhao, Bo Li:
A precision current sensing circuit with chopper amplifier of symmetric topology. Microelectron. J. 146: 106103 (2024) - [j18]Jianying Dang, Xiaowu Cai, Longli Pan, Liang Shan, Yu Lu, Yafei Xie, Xupeng Wang, Shiping Wang, Bo Li:
A Novel Reliability-Enhanced Dual Over-Temperature Protection Circuit With Delayed Thermal Restart for Power ICs. IEEE Trans. Circuits Syst. II Express Briefs 71(3): 1471-1475 (2024) - 2023
- [j17]Ruirui Xia, Xiaowu Cai, Liqiang Ding, Mali Gao, Yuexin Gao, Tian Han, Jianying Dang, Bo Li:
An on-chip integrated current sensor with high precision and large current range for smart power ICs. Microelectron. J. 134: 105686 (2023) - [j16]Tian Han, Fazhan Zhao, Xiaowu Cai, Liang Shan, Yun Tang, Bo Li:
Novel SenseFET structure for VDMOS with adopting body reverse bias technique to adjust the reference current ratio. Microelectron. J. 134: 105687 (2023) - [j15]Shuo Cai, Yan Wen, Jiangbiao Ouyang, Weizheng Wang, Fei Yu, Bo Li:
A highly reliable and low-power cross-coupled 18T SRAM cell. Microelectron. J. 134: 105729 (2023) - [c5]Yuchong Wang, Siyuan Chen, Fanyu Liu, Bo Li, Jiangjiang Li, Yang Huang, Tiexin Zhang, Xu Zhang, Zhengsheng Han, Tianchun Ye, Jing Wan:
The Effects of $\gamma$ Radiation-Induced Trapped Charges on Single Event Transient in DSOI Technology. IRPS 2023: 1-6 - 2022
- [j14]Fayu Wan, Taochen Gu, Binhong Li, Bo Li, Wenceslas Rahajandraibe, Mathieu Guerin, Sébastien Lalléchère, Blaise Ravelo:
Design and Experimentation of Inductorless Low-Pass NGD Integrated Circuit in 180-nm CMOS Technology. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(11): 4965-4974 (2022) - [c4]Xu Zhang, Fanyu Liu, Bo Li, Siyuan Chen, Yang Huang, Jiangjiang Li, Jian Jiao, Tianchun Ye, Jiajun Luo:
The Synergetic Effects of Total Ionizing Dose and High Temperature on 180 nm DSOI Technology. APCCAS 2022: 532-535 - [c3]Junjun Zhang, Fanyu Liu, Bo Li, Yang Huang, Siyuan Chen, Yuchong Wang, Jiajun Luo, Jing Wan:
Single Event Induced Crosstalk of Monolithic 3D Circuits Based on a 22 nm FD-SOI Technology. IRPS 2022: 18-1 - 2021
- [j13]Jianjian Wang, Jinshun Bi, Gang Liu, Hua Bai, Kai Xi, Bo Li, Sandip Majumdar, Lanlong Ji, Ming Liu, Zhangang Zhang:
Simulations of single event effects on the ferroelectric capacitor-based non-volatile SRAM design. Sci. China Inf. Sci. 64(4) (2021) - [j12]Konstantin O. Petrosyants, Lev M. Sambursky, Maxim V. Kozhukhov, Mamed R. Ismail-Zade, Igor A. Kharitonov, Bo Li:
SPICE Compact BJT, MOSFET, and JFET Models for ICs Simulation in the Wide Temperature Range (From -200 °C to +300 °C). IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(4): 708-722 (2021) - 2020
- [j11]Gangping Yan, Jinshun Bi, Gaobo Xu, Kai Xi, Bo Li, Linjie Fan, Huaxiang Yin:
Simulation of Total Ionizing Dose (TID) Effects Mitigation Technique for 22 nm Fully-Depleted Silicon-on-Insulator (FDSOI) Transistor. IEEE Access 8: 154898-154905 (2020) - [j10]Shuo Cai, Binyong He, Weizheng Wang, Peng Liu, Fei Yu, Lairong Yin, Bo Li:
Soft Error Reliability Evaluation of Nanoscale Logic Circuits in the Presence of Multiple Transient Faults. J. Electron. Test. 36(4): 469-483 (2020) - [j9]Linjie Fan, Jinshun Bi, Kai Xi, Sandip Majumdar, Bo Li:
Performance Optimization of FD-SOI Hall Sensors Via 3D TCAD Simulations. Sensors 20(10): 2751 (2020)
2010 – 2019
- 2019
- [j8]Kai Xi, Jinshun Bi, Sandip Majumdar, Bo Li, Jing Liu, Yannan Xu, Ming Liu:
Total ionizing dose effects on graphene-based charge-trapping memory. Sci. China Inf. Sci. 62(12): 222401 (2019) - [c2]Zhongshan Zheng, Zhentao Li, Bo Li, Jiajun Luo, Zhengsheng Han:
Influences of the Source and Drain Resistance of the MOSFETs on the Single Event Upset Hardness of SRAM cells. ASICON 2019: 1-3 - 2018
- [j7]Jinshun Bi, Yuan Duan, Kai Xi, Bo Li:
Total ionizing dose and single event effects of 1 Mb HfO2-based resistive-random-access memory. Microelectron. Reliab. 88-90: 891-897 (2018) - [j6]Haibin Wang, Xixi Dai, Yangsheng Wang, Issam Nofal, Li Cai, Zicai Shen, Wanxiu Sun, Jinshun Bi, Bo Li, Gang Guo, Li Chen, Sang H. Baeg:
A single event upset tolerant latch design. Microelectron. Reliab. 88-90: 909-913 (2018) - [j5]Bo Li, Yunbo Huang, Ling Yang, Qingzhu Zhang, Zhongshan Zheng, Binhong Li, Huiping Zhu, Jianhui Bu, Huaxiang Yin, Jiajun Luo, Zhengsheng Han, Haibin Wang:
Process variation dependence of total ionizing dose effects in bulk nFinFETs. Microelectron. Reliab. 88-90: 946-951 (2018) - [j4]Binhong Li, Yang Huang, Jianfei Wu, Yunbo Huang, Bo Li, Qingzhu Zhang, Ling Yang, Fayu Wan, Jiajun Luo, Zhengsheng Han, Huaxiang Yin:
Constant voltage stress characterization of nFinFET transistor during total ionizing dose experiment. Microelectron. Reliab. 88-90: 969-973 (2018) - 2017
- [j3]Yannan Xu, Jinshun Bi, Gaobo Xu, Kai Xi, Bo Li, Ming Liu:
Total ionizing dose effects and annealing behaviors of HfO2-based MOS capacitor. Sci. China Inf. Sci. 60(12): 120401:1-120401:3 (2017) - 2012
- [j2]Bo Li, Xuefang Lin-Shi, Bruno Allard:
Low Power Digital Alternative to Analog Control of Step-Down Converter. J. Low Power Electron. 8(5): 654-666 (2012) - [j1]Bo Li, Xuefang Lin-Shi, Bruno Allard, Jean-Marie Retif:
A Digital Dual-State-Variable Predictive Controller for High Switching Frequency Buck Converter With Improved Σ-Δ DPWM. IEEE Trans. Ind. Informatics 8(3): 472-481 (2012) - [c1]Bo Li, Xuefang Lin-Shi, Bruno Allard, Jean-Marie Retif:
An FPGA prototype of current and voltage predictive controller for high switching frequency buck converter. IECON 2012: 3024-3029
Coauthor Index
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