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2020 – today
- 2021
[j12]Chunyan Yin, Yongheng Chen, Wanli Zuo:
Evolutionary Social Poisson Factorizationfor Temporal Recommendation. Int. J. Comput. Intell. Syst. 14(1): 1-10 (2021)
2010 – 2019
- 2019
- [j11]Fateme Dinmohammadi
, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu:
Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications. IEEE Access 7: 54658-54669 (2019) - [j10]Chang Yan, Peng Li, Changchun Liu, Xinpei Wang, Chunyan Yin, Lianke Yao:
Novel gridded descriptors of poincaré plot for analyzing heartbeat interval time-series. Comput. Biol. Medicine 109: 280-289 (2019) - [j9]Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin:
Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Comput. Sci. 9(1): 200 (2019) - 2018
- [j8]Yongheng Chen, Chunyan Yin, Yaojin Lin, Wanli Zuo:
On-line Evolutionary Sentiment Topic Analysis Modeling. Int. J. Comput. Intell. Syst. 11(1): 634-651 (2018) - [j7]Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey:
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectron. Reliab. 87: 1-14 (2018) - [j6]Yongheng Chen, Chunyan Yin, Yaojin Lin, Wanli Zuo:
Multi-modal multi-layered topic classification model for social event analysis. Multim. Tools Appl. 77(18): 23291-23315 (2018) - 2015
- [j5]Chunyan Yin, Chris Best, Chris Bailey, Stoyan Stoyanov:
Statistical analysis of the impact of refinishing process on leaded components. Microelectron. Reliab. 55(2): 424-431 (2015) - 2014
- [j4]Mahera Musallam, Chunyan Yin, Chris Bailey, C. Mark Johnson:
Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules. Microelectron. Reliab. 54(1): 172-181 (2014) - 2013
- [j3]Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott:
Modelling methodology for thermal analysis of hot solder dip process. Microelectron. Reliab. 53(8): 1055-1067 (2013)
2000 – 2009
- 2009
- [j2]Hua Lu, Chris Bailey, Chunyan Yin:
Design for reliability of power electronics modules. Microelectron. Reliab. 49(9-11): 1250-1255 (2009) - 2003
- [j1]Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu:
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43(4): 625-633 (2003)
Coauthor Index
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