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Tuomo Jaakola

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2001
[j2]
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Jaakko Lenkkeri, Tuomo Jaakola:
Rapid power cycling of flip-chip and CSP components on ceramic substrates. Microelectron. Reliab. 41(5): 661-668 (2001)
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Risto Rautioaho, Olli Nousiainen, Seppo Leppävuori, Jaakko Lenkkeri, Tuomo Jaakola:
Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules. Microelectron. Reliab. 41(9-10): 1643-1648 (2001)

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