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Karl-Reinhard Merkel

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Conference and Workshop Papers

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2016
[c3]
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  - conf/3dic/Fernandez-Bolanos16
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Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati:
3D TSV based high frequency components for RF IC and RF MEMS applications. 3DIC 2016: 1-4
2010
[c2]
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  - conf/3dic/AndricekBKMMMNRWWW10
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Ladislav Andricek, Michael Beimforde, Armin Klumpp, Anna Macchiolo, Karl-Reinhard Merkel, Hans-Günther Moser, Richard Nisius, Rainer Helmut Richter, Josef Weber, Philipp Weigell, Robert Wieland:
Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC. 3DIC 2010: 1-4
[c1]
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Robert Wieland, Kai Zoschke, Nils Jurgensen, Karl-Reinhard Merkel, Lars Nebrich, Jürgen Wolf:
Silicon-interposer with high density Cu-filled TSVs. 3DIC 2010: 1-4

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