7.1 54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation.

Thu, 01 Jan 2026 00:00:00 +0100

Neale A. W. Dutton, Xavier Branca, Mathieu Thivin, Steven Collins, Herve Thuaire, Fabrice Martin, Vincent Clemencon, Mohammed Al-Rawhani, Duncan Hall, Axel Crocherie, Cédric Pastorelli, Sophie Taupin, Severin Trochut, Abhishek Singh, Andreas Assmann, Bruce Rae, Pascal Mellot:
7.1 54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation. ISSCC 2026: 112-114