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2020 – today
- 2024
[c3]Ruilong Xie, Wonhyuk Hong, Chen Zhang, Jongjin Lee, Kevin Brew, Richard Johnson, Nicholas A. Lanzillo, Hosadurga Shobha, Taesun Kim, Panjae Park, Shogo Mochizuki, Iqbal Saraf, Chanro Park, Lei Zhuang, Clifford Osborn, Wai Kin Li, Feng Liu, Muthumanickam Sankarapandian, Chung Ju Yang, Juntao Li, Lukas Tierney, Ruturaj Pujari, Yasir Sulehria, Yuncheng Song, Huimei Zhou, Miaomiao Wang, Michael Belyansky, Somnath Ghosh, Haojun Zhang, Koichi Motoyama, Debarghya Sarkar, Wukang Kim, Albert Chu, Tao Li, Fabio Carta, Oleg Gluschenkov, Joongsuk Oh, Matthew Malley, Pinlei Chu, Son Nguyen, Katherine Luedders, Joe Lee, Shahrukh Khan, Prabudhya Roy Chowdhury, Huai Huang, Abir Shadman, Stuart Sieg, Daniel Dechene, Daniel Edelstein, John Arnold, Tenko Yamashita, Kisik Choi, Kang-ill Seo, Dechao Guo, Huiming Bu:
Backside Power Distribution for Nanosheet Technologies Beyond 2nm. VLSI Technology and Circuits 2024: 1-2- 2023
- [c2]N. Breil, B.-C. Lee, J. Avila Avendano, J. Jewell, M. Vellaikal, E. Newman, E. M. Bazizi, Ashish Pal, L. Liu, Oleg Gluschenkov, A. Greene, S. Mochizuki, Nicolas Loubet, Benjamin Colombeau, Bala Haran:
Contact Cavity Shaping and Selective SiGe: B Low-Temperature Epitaxy Process Solution for sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c1]Takeshi Nogami, Oleg Gluschenkov, Yasir Sulehria, Son Nguyen, Brown Peethala, Huai Huang, Hosadurga Shobha, Nick A. Lanzillo, Raghuveer Patlolla, Devika Sil, Andrew Simon, Daniel Edelstein, Nelson Felix, Junjun Liu, Toshiyuki Tabata, Fulvio Mazzamuto, Sebastien Halty, Fabien Rozé, Yasutoshi Okuno
, Akira Uedono:
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. VLSI Technology and Circuits 2022: 423-424
1990 – 1999
- 1999
- [b1]Oleg Gluschenkov:
Development and Study of Atomic Nitrogen Sources for Synthesis of Electronic Materials. University of Illinois Urbana-Champaign, USA, 1999
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