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A. Simomura

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2021
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Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima:
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 3DIC 2021: 1-4

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