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2020 – today
- 2025
[j2]Xiaosen Liu
, Jingshu Yu, Minxiang Gong, Nicolas Butzen, Sheldon Weng, Harish K. Krishnamurthy, Krishnan Ravichandran, Ramez Hosseinian Ahangharnejhad, James Waldemer, Christopher Pelto, James W. Tschanz, Vivek De:
A Monolithic 5.7 A/mm2 91% Peak Efficiency Scalable Multistage Modular Switched Capacitor Voltage Regulator for Base Die Vertical Power Delivery in 3D-ICs. IEEE J. Solid State Circuits 60(4): 1265-1276 (2025)- 2024
- [j1]Nicolas Butzen, Harish K. Krishnamurthy, Jingshu Yu, Zakir K. Ahmed, Sheldon Weng, Krishnan Ravichandran, Ramez Hosseinian Ahangharnejhad, James Waldemer, Christopher Pelto, James W. Tschanz:
A Monolithic 12.7 W/mm2, 92% Peak-Efficiency Switched-Capacitor DC-DC Converter Using CSCR-First Topology. IEEE J. Solid State Circuits 59(12): 4114-4123 (2024) - [c4]Nicolas Butzen, Harish Krishnamurthy, Jingshu Yu, Zakir K. Ahmed, Sheldon Weng, Krishnan Ravichandran, Ramez Hosseinian Ahangharnejhad, James Waldemer, Chris Pelto, James W. Tschanz:
28.4 A Monolithic 12.7W/mm2 Pmax, 92% Peak-Efficiency CSCR-First Switched-Capacitor DC-DC Converter. ISSCC 2024: 462-464 - [c3]Christopher Pelto, R. Aggarwal, R. Ahan, M. Armstrong, M. Bebek, M. Blount, S. Chowdhury, J. Chuah, C. Connor, T. DeBonis, B. Dhayal, A. Dougless, S. Gokhale, A. Jain, V. Javvaji, K. Kamisetty, G. Kim, J. Kpetehoto, C. Kuan, C. Lin, G. Liu, Y. Ma, G. Mcpherson, S. Mokler, Christopher Perini, R. Ramaswamy, Bernhard Sell, R. Subramaniam, James Waldemer, D. Wei, Y. Yang, Y. Yang, J. Yaung, B. Sabi, S. Natarajan:
Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture. VLSI Technology and Circuits 2024: 1-2 - [c2]Jingshu Yu, Xiaosen Liu, Minxiang Gong, Nicolas Butzen, Sheldon Weng, Harish K. Krishnamurthy, Krishnan Ravichandran, Ramez Hosseinian Ahangharnejhad, Jim Waldemer, Christopher Pelto, James W. Tschanz, Vivek De:
A Monolithic 5.7A/mm2 91% Peak Efficiency Scalable Multi-Stage Modular Switched Capacitor Voltage Regulator with Self-Timed Deadtime and Safe Startup for 3D-ICs. VLSI Technology and Circuits 2024: 1-2 - 2020
- [c1]Chen-Yi Su, Mark Armstrong, Sunny Chugh, Mohammed El-tanani, Hannes Greve, Hai Li, Mahjabin Maksud, Benjamin Orr, Christopher Perini, James Palmer, Leif Paulson, Stephen Ramey, James Waldemer, Yang Yang, Dave Young:
Reliability Characterization for 12 V Application Using the 22FFL FinFET Technology. IRPS 2020: 1-5
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