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M. L. Goedecke

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2016
[c1]
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  - conf/ofc/HooseBBMDHTMLTS16
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  - https://dblp.org/rec/conf/ofc/HooseBBMDHTMLTS16
Tobias Hoose, Muhammad Rodlin Billah, Matthias Blaicher, Pablo Marin, Philipp-Immanuel Dietrich, Andreas Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, Jörg Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos:
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. OFC 2016: 1-3

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