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Ari Laor

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2017
[j1]
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Ari Laor, Depayne Athia, Alireza Rezvani, Horst Clauberg, Michael Mayer:
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding. Microelectron. Reliab. 73: 60-68 (2017)

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