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Kyoung-Moo Harr

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2015
[j2]
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Kyoung-Moo Harr, Sun-Chul Kim, Young-Min Kim, Young-Ho Kim:
Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive. Microelectron. Reliab. 55(8): 1241-1247 (2015)
2011
[j1]
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Byeung-Gee Kim, Sang-Mok Lee, Yun-Song Jo, Sun-Chul Kim, Kyoung-Moo Harr, Young-Ho Kim:
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives. Microelectron. Reliab. 51(4): 851-859 (2011)

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