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Tien-Tsorng Shih
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2020 – today
- 2023
- [c17]Kai-Chieh Chang, Chia-Ling Tsai, Wei-Chih Cheng, Zon, Chun-Nien Liu, Tien-Tsorng Shih, Sheng-Lung Huang, Charles W. Tu, Wood-Hi Cheng:
Record Gain of 18-dB for Broadband Single-Model Cr-Doped Crystalline Core Fiber by Small Core Diameter. OFC 2023: 1-3 - 2022
- [j1]Jau-Ji Jou, Tien-Tsorng Shih, Hao-Wen Hsu:
32-Gb/s NRZ and 40-Gb/s PAM-4 Transimpedance Amplifier Paralleling with a Differentiator for Bandwidth Enhancement in 90-nm CMOS Technology. Circuits Syst. Signal Process. 41(2): 621-635 (2022) - [c16]Tzu-Chun Chien, Zih-Yuan Ciou, Shih-Chun Kao, Chih-Hsien Cheng, Kuo-Fang Chung, Ding-Wei Huang, Tien-Tsorng Shih, Gong-Ru Lin:
Bias-dependent Chirping Dynamics of Single-arm Encoded Silicon Mach-Zender Interferometric Modulator. OECC/PSC 2022: 1-3 - [c15]Jim-Han Tu, Chun-Nien Liu, Tien-Tsorng Shih, Wood-Hi Cheng:
Study of High Coupling Efficiency Cone Micro-Lensed Fiber Applied in Silicon Photonics Chip Packaging. OECC/PSC 2022: 1-4 - 2021
- [c14]Shi-Yan Fang, Yu-Quan Zhuang, Ting-Jen Hsueh, Tien-Tsorng Shih:
Influence of Silver Glue on the Die Bonding Process of MEMS Gas Sensors. ISPACS 2021: 1-2 - [c13]Hao-Wen Hsu, Xuan-Yi Ye, Jau-Ji Jou, Tien-Tsorng Shih:
A 40-Gb/s NRZ Inductorless Transimpedance Amplifier in a 0.18-μm SiGe BiCMOS Technology. ISPACS 2021: 1-2 - 2020
- [c12]Chiu-Ming Liu, Jhuo-Wei Li, Chun-Nien Liu, Wei-Chih Cheng, Charles Tu, Tien-Tsorng Shih, Sheng-Lung Huang, Wood-Hi Cheng:
Tetrahedral-Cr Enhancement Employing Dielectric Coating for Higher Gain of Broadband Cr-Doped Fiber Amplifiers. OFC 2020: 1-3
2010 – 2019
- 2019
- [c11]Hao-Wen Hsu, Chih-Chen Peng, Jau-Ji Jou, Tien-Tsorng Shih, Yaw-Dung Wu, Shao-I Chu, Chih-Yuan Lien, Bing-Hong Liu:
25 Gb/s NRZ and 50 Gb/s PAM-4 Transimpedance Amplifier with Active Feedback and Equalization in 90 nm CMOS Technology. ICETE (1) 2019: 257-263 - [c10]Po-Tsung Wu, Yu-Ting Chiu, Tien-Tsorng Shih, Tsair-Chun Liang:
Reconfigurable Optical Add/drop Multiplexer Using Optical Switches and Arrayed Waveguide Gratings. ICKII 2019: 241-243 - [c9]Jian-Yu Lai, Chuan-Yu Liao, Jau-Ji Jou, Tien-Tsorng Shih, Po-Jui Chiang:
Design of High-Speed Optical Receiver Module for 160Gb/s NRZ and 200Gb/s PAM4 Transmissions. ISCAS 2019: 1-4 - [c8]Tsung-Yen Wu, Jau-Ji Jou, Tien-Tsorng Shih, Po-Jui Chiang, Yaw-Dung Wu:
Design of a 25-Gb/s PAM-4 VCSEL Diode Driver with an Equalizer in 90-nm CMOS Technology. ISCAS 2019: 1-4 - [c7]Zih-Chun Su, Chih-Hsien Cheng, Bo-Ji Huang, Huai-Yung Wang, Chun-Nien Liu, Tien-Tsorng Shih, Wood-Hi Cheng, Gong-Ru Lin:
Filtering of Mixed Data Streams with Orthogonal Polarization up to 50 Gbps in Micro-Ring/Bus Waveguide. OECC/PSC 2019: 1-3 - 2018
- [c6]Cheng-Han Wu, Ting-Yu Huang, Junyi Qiu, Wenning Fu, Chun-Yen Peng, Tien-Tsorng Shih, Jian-Jang Huang, Hao-Chung Kuo, Gong-Ru Lin, Wood-Hi Cheng, Milton Feng, Chao-Hsin Wu:
50 Gb/s Error-Free Data Transmission Using a NRZ-OOK Modulated 850 nm VCSEL. ECOC 2018: 1-3 - 2017
- [c5]Chih-Chen Peng, Jau-Ji Jou, Tien-Tsorng Shih, Chien-Liang Chiu:
High linearity transimpedance amplifier in 0.18-μm CMOS technology for 20-Gb/s PAM-4 receivers. ISOCC 2017: 182-183 - [c4]Hsuan-Yun Kao, Cheng-Ting Tsai, Chun-Yen Pong, Shan-Fong Liang, Zu-Kai Weng, Yu-Chieh Chi, Hao-Chung Kuo, Jian Jang Huang, Tai-Cheng Lee, Tien-Tsorng Shih, Jau-Ji Jou, Wood-Hi Cheng, Chao-Hsin Wu, Gong-Ru Lin:
Few-mode 850-nm VCSEL chip with direct 16-QAM OFDM encoding at 80-Gbit/s for 100-m OM4 MMF link. OFC 2017: 1-3 - 2016
- [c3]Hong-Jhih Chen, Jau-Ji Jou, Tien-Tsorng Shih:
Design of pseudo-random bit sequence generator with adjustable sinusoidal jitter. ISOCC 2016: 263-264 - [c2]Cheng-Ting Tsai, Shuo Chang, Chun-Yen Pong, Shan-Fong Liang, Yu-Chieh Chi, Chao-Hsin Wu, Tien-Tsorng Shih, Jian Jang Huang, Hao-Chung Kuo, Wood-Hi Cheng, Gong-Ru Lin:
RIN suppressed multimode 850-nm VCSEL for 56-Gbps 16-QAM OFDM and 22-Gbps PAM-4 transmission. OFC 2016: 1-3 - 2015
- [c1]Jian-Chiun Liou, Tien-Tsorng Shih, Wen-Chieh Lin, Yen-Chung Huang:
Noninvasive ECG and EMG electrode system for health monitoring and science technology application. ICCE-TW 2015: 102-103
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