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Wen Jie Ng

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2010 – 2019

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2016
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Chee Kuang Kok, Wen Jie Ng, Chin Chin Ooi, Kia Wai Liew:
Ball-grid-array solder joint model for assembly-level impact reliability prediction. Microelectron. Reliab. 65: 184-191 (2016)

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