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Andreas Schletz

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Journal Articles

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2018
[j6]
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  - journals/mr/LetzFSS18
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  - https://dblp.org/rec/journals/mr/LetzFSS18
S. A. Letz, A. Farooghian, F. B. Simon, Andreas Schletz:
Modeling the rate-dependent inelastic deformation behavior of porous polycrystalline silver films. Microelectron. Reliab. 88-90: 1113-1117 (2018)
[j5]
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F. B. Simon, S. A. Letz, Andreas Schletz:
Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles. Microelectron. Reliab. 88-90: 1183-1188 (2018)
2016
[j4]
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  - journals/mr/RandollWS16
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Richard Randoll, Wolfgang Wondrak, Andreas Schletz:
Lifetime and manufacturability of integrated power electronics. Microelectron. Reliab. 64: 513-518 (2016)
2015
[j3]
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  - journals/mr/RandollAWBS15
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Richard Randoll, Mahmud Asef, Wolfgang Wondrak, Lars Böttcher, Andreas Schletz:
Characteristics and aging of PCB embedded power electronics. Microelectron. Reliab. 55(9-10): 1634-1639 (2015)
2014
[j2]
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Richard Randoll, Wolfgang Wondrak, Andreas Schletz:
Dielectric strength and thermal performance of PCB-embedded power electronics. Microelectron. Reliab. 54(9-10): 1872-1876 (2014)
2013
[j1]
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  - journals/mr/HutzlerTS13
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Aaron Hutzler, Adam Tokarski, Andreas Schletz:
Extending the lifetime of power electronic assemblies by increased cooling temperatures. Microelectron. Reliab. 53(9-11): 1774-1777 (2013)

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