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Peter Tollafield

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2013
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Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott:
Modelling methodology for thermal analysis of hot solder dip process. Microelectron. Reliab. 53(8): 1055-1067 (2013)

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