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B. K. Lok

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Journal Articles

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2008
[j1]
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  dblp key:
  - journals/mr/WongPTLLNS08
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  persistent URL:
  - https://dblp.org/rec/journals/mr/WongPTLLNS08
C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun:
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectron. Reliab. 48(4): 611-621 (2008)

Informal and Other Publications

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2008
[i1]
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  dblp key:
  - journals/corr/abs-0805-0907
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P. W. Gian, Xuechuan Shan, Y. N. Liang, B. K. Lok, C. W. Lu, Ban-Leong Ooi:
High Aspect Pattern Formation by Integration of Micro Inkjetting and Electroless Plating. CoRR abs/0805.0907 (2008)

Coauthor Index

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