Mingyu Li

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Hongtao Chen

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Publications

2018
[j20]
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  - journals/mr/GuoSZCL18
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  - https://dblp.org/rec/journals/mr/GuoSZCL18
Qiang Guo, Siyu Sun, Zhihao Zhang, Hongtao Chen, Mingyu Li:
Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test. Microelectron. Reliab. 80: 144-148 (2018)
[j19]
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  - journals/mr/SunGCLW18
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Siyu Sun, Qiang Guo, Hongtao Chen, Mingyu Li, Chunqing Wang:
Solderless bonding with nanoporous copper as interlayer for high-temperature applications. Microelectron. Reliab. 80: 198-204 (2018)
2012
[j3]
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  - journals/mr/ChenHLL12
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Hongtao Chen, Jing Han, Jue Li, Mingyu Li:
Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing. Microelectron. Reliab. 52(6): 1112-1120 (2012)

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