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H. S. Liu

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2003
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D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen, H. S. Liu:
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability. Microelectron. Reliab. 43(6): 935-943 (2003)

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