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ORCIDBibTeX records: Umamaheswara Rao Tida
@article{DBLP:journals/access/VemuriT24,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Modeling and Design of Dual-Purpose {MIV} in Monolithic 3D {IC}},
journal = {{IEEE} Access},
volume = {12},
pages = {23066--23080},
year = {2024},
url = {https://doi.org/10.1109/ACCESS.2024.3363913},
doi = {10.1109/ACCESS.2024.3363913},
timestamp = {Sat, 16 Mar 2024 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/access/VemuriT24.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/access/ElmaVT23,
author = {Maliha Elma and
Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor
for On-Chip Multi-Phase Buck Converter},
journal = {{IEEE} Access},
volume = {11},
pages = {90563--90574},
year = {2023},
url = {https://doi.org/10.1109/ACCESS.2023.3281359},
doi = {10.1109/ACCESS.2023.3281359},
timestamp = {Thu, 14 Sep 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/access/ElmaVT23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/iccd/VemuriT23,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in
{M3D-IC} Technology},
booktitle = {41st {IEEE} International Conference on Computer Design, {ICCD} 2023,
Washington, DC, USA, November 6-8, 2023},
pages = {118--125},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/ICCD58817.2023.00027},
doi = {10.1109/ICCD58817.2023.00027},
timestamp = {Tue, 09 Jan 2024 15:43:43 +0100},
biburl = {https://dblp.org/rec/conf/iccd/VemuriT23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/isqed/VemuriT23,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Metal Inter-layer Via Keep-out-zone in {M3D} {IC:} {A} Critical Process-aware
Design Consideration},
booktitle = {24th International Symposium on Quality Electronic Design, {ISQED}
2023, San Francisco, CA, USA, April 5-7, 2023},
pages = {1--8},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/ISQED57927.2023.10129285},
doi = {10.1109/ISQED57927.2023.10129285},
timestamp = {Thu, 01 Jun 2023 22:29:52 +0200},
biburl = {https://dblp.org/rec/conf/isqed/VemuriT23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/mwscas/VemuriT23,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic
3D Integration},
booktitle = {66th {IEEE} International Midwest Symposium on Circuits and Systems,
{MWSCAS} 2023, Tempe, AZ, USA, August 6-9, 2023},
pages = {187--191},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/MWSCAS57524.2023.10405987},
doi = {10.1109/MWSCAS57524.2023.10405987},
timestamp = {Sat, 24 Feb 2024 20:42:53 +0100},
biburl = {https://dblp.org/rec/conf/mwscas/VemuriT23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/socc/VemuriT23,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
editor = {J{\"{u}}rgen Becker and
Andrew Marshall and
Tanja Harbaum and
Amlan Ganguly and
Fahad Siddiqui and
Kieran McLaughlin},
title = {{FDSOI} Process Based MIV-transistor Utilization for Standard Cell
Designs in Monolithic 3D Integration},
booktitle = {36th {IEEE} International System-on-Chip Conference, {SOCC} 2023,
Santa Clara, CA, USA, September 5-8, 2023},
pages = {1--6},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/SOCC58585.2023.10257022},
doi = {10.1109/SOCC58585.2023.10257022},
timestamp = {Tue, 21 Nov 2023 07:48:13 +0100},
biburl = {https://dblp.org/rec/conf/socc/VemuriT23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/corr/abs-2304-13808,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Metal Inter-layer Via Keep-out-zone in {M3D} {IC:} {A} Critical Process-aware
Design Consideration},
journal = {CoRR},
volume = {abs/2304.13808},
year = {2023},
url = {https://doi.org/10.48550/arXiv.2304.13808},
doi = {10.48550/ARXIV.2304.13808},
eprinttype = {arXiv},
eprint = {2304.13808},
timestamp = {Wed, 03 May 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/corr/abs-2304-13808.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/corr/abs-2306-14032,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {{FDSOI} Process Based MIV-transistor Utilization for Standard Cell
Designs in Monolithic 3D Integration},
journal = {CoRR},
volume = {abs/2306.14032},
year = {2023},
url = {https://doi.org/10.48550/arXiv.2306.14032},
doi = {10.48550/ARXIV.2306.14032},
eprinttype = {arXiv},
eprint = {2306.14032},
timestamp = {Tue, 27 Jun 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/corr/abs-2306-14032.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/corr/abs-2306-14033,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Efficient and Scalable MIV-transistor with Extended Gate in Monolithic
3D Integration},
journal = {CoRR},
volume = {abs/2306.14033},
year = {2023},
url = {https://doi.org/10.48550/arXiv.2306.14033},
doi = {10.48550/ARXIV.2306.14033},
eprinttype = {arXiv},
eprint = {2306.14033},
timestamp = {Tue, 27 Jun 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/corr/abs-2306-14033.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/todaes/WenDCTSZ22,
author = {Chenyi Wen and
Xiao Dong and
Baixin Chen and
Umamaheswara Rao Tida and
Yiyu Shi and
Cheng Zhuo},
title = {Magnetic Core TSV-Inductor Design and Optimization for On-chip {DC-DC}
Converter},
journal = {{ACM} Trans. Design Autom. Electr. Syst.},
volume = {27},
number = {5},
pages = {52:1--52:23},
year = {2022},
url = {https://doi.org/10.1145/3507700},
doi = {10.1145/3507700},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/todaes/WenDCTSZ22.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/tcad/TidaZLS20,
author = {Umamaheswara Rao Tida and
Cheng Zhuo and
Leibo Liu and
Yiyu Shi},
title = {Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via
Inductor Utilization in Resonant Clocking},
journal = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
volume = {39},
number = {2},
pages = {281--293},
year = {2020},
url = {https://doi.org/10.1109/TCAD.2018.2887053},
doi = {10.1109/TCAD.2018.2887053},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/tcad/TidaZLS20.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/mwscas/VemuriT20,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional
{(M3D)} Integration},
booktitle = {63rd {IEEE} International Midwest Symposium on Circuits and Systems,
{MWSCAS} 2020, Springfield, MA, USA, August 9-12, 2020},
pages = {424--427},
publisher = {{IEEE}},
year = {2020},
url = {https://doi.org/10.1109/MWSCAS48704.2020.9184698},
doi = {10.1109/MWSCAS48704.2020.9184698},
timestamp = {Mon, 21 Sep 2020 12:35:49 +0200},
biburl = {https://dblp.org/rec/conf/mwscas/VemuriT20.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/mwscas/VemuriT20a,
author = {Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase
Buck Converter},
booktitle = {63rd {IEEE} International Midwest Symposium on Circuits and Systems,
{MWSCAS} 2020, Springfield, MA, USA, August 9-12, 2020},
pages = {933--936},
publisher = {{IEEE}},
year = {2020},
url = {https://doi.org/10.1109/MWSCAS48704.2020.9184471},
doi = {10.1109/MWSCAS48704.2020.9184471},
timestamp = {Mon, 21 Sep 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/mwscas/VemuriT20a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/socc/TidaV20,
author = {Umamaheswara Rao Tida and
Madhava Sarma Vemuri},
title = {Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional
Integrated Circuits},
booktitle = {33rd {IEEE} International System-on-Chip Conference, SoCC 2020, Las
Vegas, NV, USA, September 8-11, 2020},
pages = {195--200},
publisher = {{IEEE}},
year = {2020},
url = {https://doi.org/10.1109/SOCC49529.2020.9524756},
doi = {10.1109/SOCC49529.2020.9524756},
timestamp = {Tue, 14 Sep 2021 10:14:37 +0200},
biburl = {https://dblp.org/rec/conf/socc/TidaV20.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/corr/abs-2001-10678,
author = {Dawei Li and
Madhava Sarma Vemuri and
Umamaheswara Rao Tida},
title = {An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via
Inductor in Three-dimensional Integrated Circuits},
journal = {CoRR},
volume = {abs/2001.10678},
year = {2020},
url = {https://arxiv.org/abs/2001.10678},
eprinttype = {arXiv},
eprint = {2001.10678},
timestamp = {Sat, 23 Jan 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/corr/abs-2001-10678.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/tvlsi/TidaZS19,
author = {Umamaheswara Rao Tida and
Cheng Zhuo and
Yiyu Shi},
title = {Single-Inductor-Multiple-Tier Regulation: TSV-Inductor-Based On-Chip
Buck Converters for 3-D {IC} Power Delivery},
journal = {{IEEE} Trans. Very Large Scale Integr. Syst.},
volume = {27},
number = {10},
pages = {2305--2316},
year = {2019},
url = {https://doi.org/10.1109/TVLSI.2019.2919606},
doi = {10.1109/TVLSI.2019.2919606},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/tvlsi/TidaZS19.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/iccad/ChenTZS18,
author = {Baixin Chen and
Umamaheswara Rao Tida and
Cheng Zhuo and
Yiyu Shi},
editor = {Iris Bahar},
title = {Modeling and optimization of magnetic core TSV-inductor for on-chip
{DC-DC} converter},
booktitle = {Proceedings of the International Conference on Computer-Aided Design,
{ICCAD} 2018, San Diego, CA, USA, November 05-08, 2018},
pages = {16},
publisher = {{ACM}},
year = {2018},
url = {https://doi.org/10.1145/3240765.3240829},
doi = {10.1145/3240765.3240829},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/iccad/ChenTZS18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/tvlsi/TidaYZS15,
author = {Umamaheswara Rao Tida and
Rongbo Yang and
Cheng Zhuo and
Yiyu Shi},
title = {On the Efficacy of Through-Silicon-Via Inductors},
journal = {{IEEE} Trans. Very Large Scale Integr. Syst.},
volume = {23},
number = {7},
pages = {1322--1334},
year = {2015},
url = {https://doi.org/10.1109/TVLSI.2014.2338862},
doi = {10.1109/TVLSI.2014.2338862},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/tvlsi/TidaYZS15.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/jetc/TidaZS14,
author = {Umamaheswara Rao Tida and
Cheng Zhuo and
Yiyu Shi},
title = {Novel Through-Silicon-Via Inductor-Based On-Chip {DC-DC} Converter
Designs in 3D ICs},
journal = {{ACM} J. Emerg. Technol. Comput. Syst.},
volume = {11},
number = {2},
pages = {16:1--16:14},
year = {2014},
url = {https://doi.org/10.1145/2637481},
doi = {10.1145/2637481},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/jetc/TidaZS14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/aspdac/TidaZS14,
author = {Umamaheswara Rao Tida and
Cheng Zhuo and
Yiyu Shi},
title = {Through-silicon-via inductor: Is it real or just a fantasy?},
booktitle = {19th Asia and South Pacific Design Automation Conference, {ASP-DAC}
2014, Singapore, January 20-23, 2014},
pages = {837--842},
publisher = {{IEEE}},
year = {2014},
url = {https://doi.org/10.1109/ASPDAC.2014.6742994},
doi = {10.1109/ASPDAC.2014.6742994},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/aspdac/TidaZS14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/iccad/TidaMZS14,
author = {Umamaheswara Rao Tida and
Varun Mittapalli and
Cheng Zhuo and
Yiyu Shi},
editor = {Yao{-}Wen Chang},
title = {Opportunistic through-silicon-via inductor utilization in {LC} resonant
clocks: concept and algorithms},
booktitle = {The {IEEE/ACM} International Conference on Computer-Aided Design,
{ICCAD} 2014, San Jose, CA, USA, November 3-6, 2014},
pages = {750--757},
publisher = {{IEEE}},
year = {2014},
url = {https://doi.org/10.1109/ICCAD.2014.7001435},
doi = {10.1109/ICCAD.2014.7001435},
timestamp = {Tue, 13 Dec 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/iccad/TidaMZS14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/isvlsi/TidaMZS14,
author = {Umamaheswara Rao Tida and
Varun Mittapalli and
Cheng Zhuo and
Yiyu Shi},
title = {"Green" On-chip Inductors in Three-Dimensional Integrated
Circuits},
booktitle = {{IEEE} Computer Society Annual Symposium on VLSI, {ISVLSI} 2014, Tampa,
FL, USA, July 9-11, 2014},
pages = {571--576},
publisher = {{IEEE} Computer Society},
year = {2014},
url = {https://doi.org/10.1109/ISVLSI.2014.117},
doi = {10.1109/ISVLSI.2014.117},
timestamp = {Fri, 24 Mar 2023 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/isvlsi/TidaMZS14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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