BibTeX records: M. Mayer

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@article{DBLP:journals/mr/GomesML15,
  author       = {J. Gomes and
                  M. Mayer and
                  Bill S. Lin},
  title        = {Development of a fast method for optimization of Au ball bond process},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {3-4},
  pages        = {602--607},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2014.12.013},
  doi          = {10.1016/J.MICROREL.2014.12.013},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/GomesML15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/RezvaniSMZM13,
  author       = {Alireza Rezvani and
                  Aashish Shah and
                  M. Mayer and
                  Norman Y. Zhou and
                  J. T. Moon},
  title        = {Role of impact ultrasound on bond strength and Al pad splash in Cu
                  wire bonding},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {7},
  pages        = {1002--1008},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2013.03.003},
  doi          = {10.1016/J.MICROREL.2013.03.003},
  timestamp    = {Mon, 13 Nov 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/RezvaniSMZM13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/PequegnatKMZPM11,
  author       = {A. Pequegnat and
                  H. J. Kim and
                  M. Mayer and
                  Norman Y. Zhou and
                  John Persic and
                  J. T. Moon},
  title        = {Effect of gas type and flow rate on Cu free air ball formation in
                  thermosonic wire bonding},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {1},
  pages        = {43--52},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2010.02.023},
  doi          = {10.1016/J.MICROREL.2010.02.023},
  timestamp    = {Mon, 13 Nov 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/PequegnatKMZPM11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/QinSHMMZ11,
  author       = {I. Qin and
                  Aashish Shah and
                  C. Huynh and
                  M. Meyer and
                  M. Mayer and
                  Norman Y. Zhou},
  title        = {Role of process parameters on bondability and pad damage indicators
                  in copper ball bonding},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {1},
  pages        = {60--66},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2010.04.001},
  doi          = {10.1016/J.MICROREL.2010.04.001},
  timestamp    = {Mon, 13 Nov 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/QinSHMMZ11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/ShahRMZPM11,
  author       = {Aashish Shah and
                  Alireza Rezvani and
                  M. Mayer and
                  Norman Y. Zhou and
                  John Persic and
                  J. T. Moon},
  title        = {Reduction of ultrasonic pad stress and aluminum splash in copper ball
                  bonding},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {1},
  pages        = {67--74},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2010.06.002},
  doi          = {10.1016/J.MICROREL.2010.06.002},
  timestamp    = {Mon, 13 Nov 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ShahRMZPM11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/MayerMP09,
  author       = {M. Mayer and
                  J. T. Moon and
                  John Persic},
  title        = {Measuring stress next to Au ball bond during high temperature aging},
  journal      = {Microelectron. Reliab.},
  volume       = {49},
  number       = {7},
  pages        = {771--781},
  year         = {2009},
  url          = {https://doi.org/10.1016/j.microrel.2009.03.018},
  doi          = {10.1016/J.MICROREL.2009.03.018},
  timestamp    = {Tue, 20 Oct 2020 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/MayerMP09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/HangWMTZW08,
  author       = {Chunjing Hang and
                  Chunqing Wang and
                  M. Mayer and
                  Yanhong Tian and
                  Norman Y. Zhou and
                  Honghui Wang},
  title        = {Growth behavior of Cu/Al intermetallic compounds and cracks in copper
                  ball bonds during isothermal aging},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {3},
  pages        = {416--424},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2007.06.008},
  doi          = {10.1016/J.MICROREL.2007.06.008},
  timestamp    = {Sat, 03 Feb 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/HangWMTZW08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/iui/BarlettaMM04,
  author       = {A. Barletta and
                  M. Mayer and
                  B. Moser},
  editor       = {Jean Vanderdonckt and
                  Nuno Jardim Nunes and
                  Charles Rich},
  title        = {Leafing digital content},
  booktitle    = {Proceedings of the 9th International Conference on Intelligent User
                  Interfaces, {IUI} 2004, Funchal, Madeira, Portugal, January 13-16,
                  2004},
  pages        = {217--219},
  publisher    = {{ACM}},
  year         = {2004},
  url          = {https://doi.org/10.1145/964442.964484},
  doi          = {10.1145/964442.964484},
  timestamp    = {Tue, 06 Nov 2018 11:07:40 +0100},
  biburl       = {https://dblp.org/rec/conf/iui/BarlettaMM04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/gmds/NorgallMH94,
  author       = {Thomas Norgall and
                  M. Mayer and
                  G. Hergenr{\"{o}}der},
  editor       = {Hildebrand Kunath and
                  Ulrich Lochmann and
                  R. Straube and
                  Karl{-}Heinz J{\"{o}}ckel and
                  C. O. K{\"{o}}hler},
  title        = {{\"{U}}bergang zwischen ISO/OSI-Anwendungsprotokollen {X.400}
                  und {MAP} {MMS} f{\"{u}}r eine KKS-Laboranbindung},
  booktitle    = {Medizin und Information, 39. Jahrestagung der GMDS, Dresden, September
                  1994},
  pages        = {85--87},
  publisher    = {{MMV} Medizin Verlag},
  year         = {1994},
  timestamp    = {Fri, 17 Mar 2017 13:28:45 +0100},
  biburl       = {https://dblp.org/rec/conf/gmds/NorgallMH94.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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