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Jun feng Zhao (Selection)

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1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLFang Liu, Guang Meng, Mei Zhao, Jun feng Zhao: Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact. Microelectronics Reliability 49(1): 79-85 (2009)

Selection of 1 from 1 records - Jun feng Zhao has 3 coauthors

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