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G. Q. Zhang (Selection)

G. Q. (Kouchi) Zhang

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30Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLXiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont: A fast moisture sensitivity level qualification method. Microelectronics Reliability 50(9-11): 1654-1660 (2010)
28Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLOlaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang: Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectronics Reliability 49(8): 853-860 (2009)
26Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLS. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang: Numerical prediction of failure paths at a roughened metal/polymer interface. Microelectronics Reliability 49(9-11): 1315-1318 (2009)
25Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLCadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang: The need for multi-scale approaches in Cu/low-k reliability issues. Microelectronics Reliability 48(6): 833-842 (2008)
20Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLM. A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken: Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectronics Reliability 47(2-3): 179-186 (2007)
11Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLCadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout: Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectronics Reliability 47(9-11): 1483-1491 (2007)
10Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLXiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang: Characterization of moisture properties of polymers for IC packaging. Microelectronics Reliability 47(9-11): 1685-1689 (2007)
6Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLR. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang: Multiscale modelling of multilayer substrates. Microelectronics Reliability 46(9-11): 1472-1477 (2006)
5Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLC. Yuan, W. D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, R. A. B. Engelen, Leo J. Ernst, F. van Keulen, G. Q. Zhang: Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability 46(9-11): 1679-1684 (2006)
4Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLW. D. van Driel, Olaf van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang: Reliability modelling for packages in flexible end-products. Microelectronics Reliability 46(9-11): 1880-1885 (2006)

Selection of 10 from 32 records - G. Q. Zhang has 58 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page