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Winco K. C. Yung (Selection)

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4Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLAsit Kumar Gain, Y. C. Chan, Winco K. C. Yung: Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectronics Reliability 51(12): 2306-2313 (2011)
3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLAsit Kumar Gain, Y. C. Chan, Winco K. C. Yung: Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates. Microelectronics Reliability 51(5): 975-984 (2011)
2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLTama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung: Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. Microelectronics Reliability 2010: 2051-2058
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLAsit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung: Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. Microelectronics Reliability 49(7): 746-753 (2009)

Selection of 4 from 4 records - Winco K. C. Yung has 5 coauthors

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