Esther Wai Ching Yau (Selection)

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Esther Wai Ching Yau, Jing Feng Gong, Philip Chan: Al surface morphology effect on flip-chip solder bump shear strength. Microelectronics Reliability 44(2): 323-331 (2004)

Selection of 1 from 1 records - Esther Wai Ching Yau has 2 coauthors