Eric Wong (Selection)

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7 Eric Wong, Sung Kyu Lim: Whitespace redistribution for thermal via insertion in 3D stacked ICs. ICCD 2007: 267-272

6 Eric Wong, Jacob R. Minz, Sung Kyu Lim: Decoupling-Capacitor Planning and Sizing for Noise and Leakage Reduction. IEEE Trans. on CAD of Integrated Circuits and Systems 26(11): 2023-2034 (2007)

5 Eric Wong, Sung Kyu Lim: 3D floorplanning with thermal vias. DATE 2006: 878-883

4 Eric Wong, Jacob R. Minz, Sung Kyu Lim: Decoupling capacitor planning and sizing for noise and leakage reduction. ICCAD 2006: 395-400

3 Eric Wong, Jacob R. Minz, Sung Kyu Lim: Multi-Objective Module Placement For 3-D System-On-Package. IEEE Trans. VLSI Syst. 14(5): 553-557 (2006)

Selection of 5 from 7 records - Eric Wong has 7 coauthors

7		Eric Wong, Sung Kyu Lim: Whitespace redistribution for thermal via insertion in 3D stacked ICs. ICCD 2007: 267-272
6		Eric Wong, Jacob R. Minz, Sung Kyu Lim: Decoupling-Capacitor Planning and Sizing for Noise and Leakage Reduction. IEEE Trans. on CAD of Integrated Circuits and Systems 26(11): 2023-2034 (2007)
5		Eric Wong, Sung Kyu Lim: 3D floorplanning with thermal vias. DATE 2006: 878-883
4		Eric Wong, Jacob R. Minz, Sung Kyu Lim: Decoupling capacitor planning and sizing for noise and leakage reduction. ICCAD 2006: 395-400
3		Eric Wong, Jacob R. Minz, Sung Kyu Lim: Multi-Objective Module Placement For 3-D System-On-Package. IEEE Trans. VLSI Syst. 14(5): 553-557 (2006)