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| 19 | Zhihua Dong, Jinyan Wang, C. P. Wen, Shenghou Liu, Rumin Gong, Min Yu, Yilong Hao, Fujun Xu, Bo Shen, Yangyuan Wang: High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure. Microelectronics Reliability 52(2): 434-438 (2012) |
Selection of 1 from 20 records - Yangyuan Wang has 68 coauthors
Last update 2012-09-10 CET by the DBLP Team —
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