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| 3 | J. de Vries, J. van Delft, C. Slob: 100 mum Pitch flip chip on foil assemblies with adhesive interconnections. Microelectronics Reliability 45(3-4): 527-534 (2005) |
Selection of 1 from 6 records - J. de Vries has 10 coauthors
Last update 2012-02-17 CET by the DBLP Team —
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