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Bart Swinnen (Selection)

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5Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLAnne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen: 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4

Selection of 1 from 7 records - Bart Swinnen has 40 coauthors

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