Randy H. Steinvorth (Selection)

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2 Jack F. McDonald, Hans J. Greub, Randy H. Steinvorth, Brian J. Donlan, Albert S. Bergendahl: Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. IEEE Computer 20(4): 21-35 (1987)

Selection of 1 from 3 records - Randy H. Steinvorth has 6 coauthors

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