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Shiv Govind Singh (Selection)

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2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLShiv Govind Singh, Chuan Seng Tan: Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. 3DIC 2009: 1-4
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLDau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan: Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. 3DIC 2009: 1-5

Selection of 2 from 2 records - Shiv Govind Singh has 5 coauthors

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