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Nicolas Sillon (Selection)

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3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLPatrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon: First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC 2009: 1-5
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLLionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey: Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC 2009: 1-7

Selection of 2 from 5 records - Nicolas Sillon has 53 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page