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Arun Sharma (Selection)

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95Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLBing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker: 3D chip stacking with C4 technology. IBM Journal of Research and Development 52(6): 599-609 (2008)
86Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLJohn U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang: Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM Journal of Research and Development 49(4-5): 725-754 (2005)

Selection of 2 from 105 records - Arun Sharma has 64 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page