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Mariam Sadaka (Selection)

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1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLIonut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, F. Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka: Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC 2010: 1-6

Selection of 1 from 3 records - Mariam Sadaka has 18 coauthors

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