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Kenneth P. Rodbell (Selection)

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1no EE pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLChao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin: Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM Journal of Research and Development 39(4): 465-498 (1995)

Selection of 1 from 5 records - Kenneth P. Rodbell has 14 coauthors

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