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| 3 | Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon: Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 3DIC 2010: 1-4 | |
| 2 | Gregory Riou, Gweltaz Gaudin, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon, Boris V. Kamenev, Michael Darwin, Robert Sachs: Pre bonding metrology solutions for 3D integration. 3DIC 2010: 1-5 |
Selection of 2 from 3 records - Gregory Riou has 18 coauthors
Last update 2012-09-10 CET by the DBLP Team —
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