Walter De Raedt (Selection)

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6 J. Balachandran, Steven Brebels, G. Carchon, T. Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Analysis and modeling of power grid transmission lines. DATE 2006: 33-38

5 J. Balachandran, Steven Brebels, G. Carchon, Walter De Raedt, Eric Beyne, Maarten Kuijk, Bart Nauwelaers: Constant Impedance Scaling Paradigm for Scaling LC transmission lines. ISQED 2006: 387-392

4 J. Balachandran, Steven Brebels, G. Carchon, Maarten Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Constant impedance scaling paradigm for interconnect synthesis. SLIP 2006: 99-105

3 J. Balachandran, Steven Brebels, G. Carchon, Maarten Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Wafer-level package interconnect options. IEEE Trans. VLSI Syst. 14(6): 654-659 (2006)

2 J. Balachandran, Steven Brebels, G. Carchon, T. Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Package level interconnect options. SLIP 2005: 21-27

Selection of 5 from 6 records - Walter De Raedt has 9 coauthors

6		J. Balachandran, Steven Brebels, G. Carchon, T. Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Analysis and modeling of power grid transmission lines. DATE 2006: 33-38
5		J. Balachandran, Steven Brebels, G. Carchon, Walter De Raedt, Eric Beyne, Maarten Kuijk, Bart Nauwelaers: Constant Impedance Scaling Paradigm for Scaling LC transmission lines. ISQED 2006: 387-392
4		J. Balachandran, Steven Brebels, G. Carchon, Maarten Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Constant impedance scaling paradigm for interconnect synthesis. SLIP 2006: 99-105
3		J. Balachandran, Steven Brebels, G. Carchon, Maarten Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Wafer-level package interconnect options. IEEE Trans. VLSI Syst. 14(6): 654-659 (2006)
2		J. Balachandran, Steven Brebels, G. Carchon, T. Webers, Walter De Raedt, Bart Nauwelaers, Eric Beyne: Package level interconnect options. SLIP 2005: 21-27