G. Pellegrini (Selection)

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2 M. Ullán, M. Lozano, M. Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, R. Martínez, G. Pellegrini, C. Puigdengoles: Test structure assembly for bump bond yield measurement on high density flip chip technologies. Microelectronics Reliability 46(7): 1095-1100 (2006)

Selection of 1 from 2 records - G. Pellegrini has 10 coauthors

Last update 2012-09-10 CET by the DBLP Team —

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