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Chirag S. Patel (Selection)

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11Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLJohn U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright: Three-dimensional silicon integration. IBM Journal of Research and Development 52(6): 553-569 (2008)
10Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLBing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker: 3D chip stacking with C4 technology. IBM Journal of Research and Development 52(6): 599-609 (2008)
9Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLKatsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker: 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development 52(6): 611-622 (2008)

Selection of 3 from 12 records - Chirag S. Patel has 45 coauthors

Last update 2012-09-10 CET by the DBLP TeamThis material is Open Data Content released under the ODC-BY 1.0 license — See also our legal information page