| 11 |  | John U. Knickerbocker,
Paul S. Andry,
Bing Dang,
Raymond R. Horton,
Mario J. Interrante,
Chirag S. Patel,
Robert J. Polastre,
Katsuyuki Sakuma,
Ranjani Sirdeshmukh,
Edmund J. Sprogis,
Sri M. Sri-Jayantha,
Antonio M. Stephens,
Anna W. Topol,
Cornelia K. Tsang,
Bucknell C. Webb,
Steven L. Wright:
Three-dimensional silicon integration.
IBM Journal of Research and Development 52(6): 553-569 (2008) |
| 10 |  | Bing Dang,
Steven L. Wright,
Paul S. Andry,
Edmund J. Sprogis,
Cornelia K. Tsang,
M. John Interrante,
Bucknell C. Webb,
Robert J. Polastre,
Raymond R. Horton,
Chirag S. Patel,
Arun Sharma,
J. Zheng,
Katsuyuki Sakuma,
John U. Knickerbocker:
3D chip stacking with C4 technology.
IBM Journal of Research and Development 52(6): 599-609 (2008) |
| 9 |  | Katsuyuki Sakuma,
Paul S. Andry,
Cornelia K. Tsang,
Steven L. Wright,
Bing Dang,
Chirag S. Patel,
Bucknell C. Webb,
J. Maria,
Edmund J. Sprogis,
S. K. Kang,
Robert J. Polastre,
Raymond R. Horton,
John U. Knickerbocker:
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.
IBM Journal of Research and Development 52(6): 611-622 (2008) |
Selection of 3 from 12 records - Chirag S. Patel has 45 coauthors