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Colin McDonough (Selection)

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2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLBenjamin Backes, Colin McDonough, Larry Smith, Wei Wang, Robert E. Geer: Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. J. Electronic Testing 28(1): 53-62 (2012)

Selection of 1 from 2 records - Colin McDonough has 7 coauthors

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